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Please use this identifier to cite or link to this item: http://dspace.bits-pilani.ac.in:8080/jspui/xmlui/handle/123456789/11947
Title: A novel approach for facile synthesis of Cu-Ni/GNPs composites with excellent mechanical and tribological properties
Authors: Rathore, Jitendra S.
Belgamwar, Sachin U.
Keywords: Mechanical Engineering
Powder metallurgy
Graphene Nanoplatelets
Electrochemical-co-deposition
Cu-Ni alloy
Hardness
Issue Date: Oct-2020
Publisher: Elsevier
Abstract: Cu-Ni alloys have extensive applications in automobile, aerospace and marine industries due to their admirable physical, mechanical and chemical properties. However, further enhancement in the properties of Cu-Ni alloys through the incorporation of nanoparticles can promote their utilization in industrial applications. In this research, graphene nanoplatelets (GNPs) reinforced Cu-Ni alloy matrix composites were synthesized through a modified electrochemical-co-deposition method followed by convectional powder metallurgy method. Uniform dispersion of pristine GNPs in the Cu-Ni alloy matrix without damaging its structure is observed. Mechanical properties and tribological behaviour of Cu-Ni/GNPs composites were analysed. Vickers hardness, yield strength (YS), and ultimate tensile strength (UTS) of the sintered Cu-Ni/GNPs (200 mg/L) composite are 107 HV, 265 MPa and 299 MPa corresponding to an increment of 84.5%, 138.7% and 90.5%, respectively compared to that of pure Cu-Ni alloy. Cu-Ni/GNPs composites exhibited reduced friction coefficients and wear rates, associated with microstructural refinement and GNPs content. The results suggest that the combination of a modified electrochemical-co-deposition and powder metallurgy methods delivers a novel approach for facile synthesis of Cu-Ni/GNPs composite with excellent mechanical and tribological properties.
URI: https://www.sciencedirect.com/science/article/pii/S0921510720301501
http://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/11947
Appears in Collections:Department of Mechanical engineering

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