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dc.contributor.authorBelgamwar, Sachin U.-
dc.contributor.authorRathore, Jitendra S.-
dc.date.accessioned2023-09-18T08:44:02Z-
dc.date.available2023-09-18T08:44:02Z-
dc.date.issued2020-
dc.identifier.urihttps://www.sciencedirect.com/science/article/abs/pii/S2214785320314942-
dc.identifier.urihttp://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/11950-
dc.description.abstractCopper (Cu) is the most widely used as a cost-effective material in electronic industries due to its high electrical and thermal conductivity along with good ductility. However, the low mechanical strength of the pure form of Cu limits its applications. Cu-graphene nanoplatelets (Cu-GNPs) composites could be implemented as structural materials for electrical power generation, transmission, and distribution where high mechanical strength is required. In this research, GNPs reinforced Cu matrix composite was fabricated using electro-co-deposition and powder metallurgy. The Cu-GNPs composite powder was characterized by field emission scanning electron microscopy (FESEM) and X-ray diffraction (XRD) to study the effect of GNPs incorporation on the surface morphology and crystallite size. Sintered samples fabricated from Cu-GNPs composite powder shows improved hardness and mechanical strength as compared to pure Cu. The improved hardness and mechanical strength of Cu-GNPs composite depend on the gren_US
dc.language.isoenen_US
dc.publisherElsevieren_US
dc.subjectMechanical Engineeringen_US
dc.subjectGraphene nanoplatelets (GNPs)en_US
dc.subjectCu-GNPs compositesen_US
dc.titleThe influence of graphene nanoplatelets (GNPs) addition on the microstructure and mechanical properties of Cu-GNPs composites fabricated by electro-co-deposition and powder metallurgyen_US
dc.typeArticleen_US
Appears in Collections:Department of Mechanical engineering

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