DSpace logo

Please use this identifier to cite or link to this item: http://dspace.bits-pilani.ac.in:8080/jspui/xmlui/handle/123456789/12206
Full metadata record
DC FieldValueLanguage
dc.contributor.authorBhatt, Geeta-
dc.date.accessioned2023-10-05T09:01:16Z-
dc.date.available2023-10-05T09:01:16Z-
dc.date.issued2014-
dc.identifier.urihttps://journals.sagepub.com/doi/full/10.1177/0954405414522797-
dc.identifier.urihttp://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12206-
dc.description.abstractIn this study, the surface modification and metallurgical analysis of three commonly used die steels were analyzed by microstructure and X-ray diffraction analysis after electric discharge machining and powder-mixed electric discharge machining. The effect of many process parameters was assessed for surface modification using magnetic field–assisted electric discharge machining process. It was observed that the microhardness of the machined surface increased by more than 200%. The analysis of machined surface confirmed material migration from added powder, dielectric and electrode. The magnetic field assisted in improving the material removal process. The strength of the magnetic field resulted in better expelling of material from workpiece and restricted the material migration from electrode especially in copper-based diamagnetic material. Deposition of tungsten and titanium carbide was observed, which increased the microhardness significantly. Titanium, tungsten and graphite powder aided favorably the increase in the microhardness.en_US
dc.language.isoenen_US
dc.publisherSageen_US
dc.subjectMechanical Engineeringen_US
dc.subjectAISI D2en_US
dc.subjectH13 die steelen_US
dc.subjectMagnetic field–assisteden_US
dc.titleMaterial transfer mechanism during magnetic field–assisted electric discharge machining of AISI D2, D3 and H13 die steelen_US
dc.typeArticleen_US
Appears in Collections:Department of Mechanical engineering

Files in This Item:
There are no files associated with this item.


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.