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Please use this identifier to cite or link to this item: http://dspace.bits-pilani.ac.in:8080/jspui/xmlui/handle/123456789/12534
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dc.contributor.authorRoy, Tribeni-
dc.date.accessioned2023-10-19T10:21:45Z-
dc.date.available2023-10-19T10:21:45Z-
dc.date.issued2022-
dc.identifier.urihttps://www.taylorfrancis.com/chapters/edit/10.1201/9780429160011-6/electrical-discharge-diamond-grinding-tribeni-roy-satish-mullya-
dc.identifier.urihttp://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12534-
dc.description.abstractThe current requirement for complex systems has prompted the development of novel materials that are both strong and lightweight. Machining complex shapes on these materials is always a difficulty. Also, it is challenging to achieve satisfactory results with a single machining process. As a result, hybrid machining processes are commonly utilized to achieve excellent precision and polish. Electrical discharge diamond grinding (EDDG) is an example of a hybrid process that combines the benefits of both EDM and mechanical grinding. Hard and brittle conductive materials are softened by electrical discharges, which is followed by mechanical grinding to remove the softened layer. EDDG eliminates the difficulties associated with EDM (such as recast layer, heat-affected zone) and scratching due to excessive grinding forces. This chapter provides an overview of mathematical models used in the EDDG process to predict cutting forces and material removal.en_US
dc.language.isoenen_US
dc.publisherCRC Pressen_US
dc.subjectMechanical Engineeringen_US
dc.subjectElectrical Dischargeen_US
dc.subjectDiamond Grindingen_US
dc.titleElectrical Discharge Diamond Grindingen_US
dc.typeBook chapteren_US
Appears in Collections:Department of Mechanical engineering

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