DSpace logo

Please use this identifier to cite or link to this item: http://dspace.bits-pilani.ac.in:8080/jspui/xmlui/handle/123456789/12539
Full metadata record
DC FieldValueLanguage
dc.contributor.authorRoy, Tribeni-
dc.date.accessioned2023-10-19T11:06:27Z-
dc.date.available2023-10-19T11:06:27Z-
dc.date.issued2016-
dc.identifier.urihttps://www.comsol.com/paper/pulsed-electric-field-based-material-removal-in-microelectrical-discharge-machin-43611-
dc.identifier.urihttp://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12539-
dc.description.abstractMicro electrical discharge machining (MEDM), a scaled down version of EDM process, is a micro machining process used to fabricate micro holes and intricate shapes in electrically conductive materials irrespective of its hardness. In this process, an electric spark is generated in the gap between the two electrodes (tool as cathode and workpiece as anode) submerged in dielectric that leads to a plasma formation, which eventually leads to material removal by melting and vaporization. The mechanism of material removal in MEDM is a very complex process and hence has not been understood fully. Simulation of material removal has been carried out in this study by using COMSOL Multiphysics® software to understand the behavior of pulsating electric field in MEDM. Assuming a constant heat flux, it has been shown that material removal takes place whenever the electric field strength at any particular location on the workpiece crosses the threshold value.en_US
dc.language.isoenen_US
dc.publisherCOMSOLen_US
dc.subjectMechanical Engineeringen_US
dc.subjectMicro electrical discharge machining (MEDM)en_US
dc.subjectElectric fieldsen_US
dc.subjectMicroelectrical Discharge Machiningen_US
dc.titlePulsed Electric Field Based Material Removal in Microelectrical Discharge Machiningen_US
dc.typeArticleen_US
Appears in Collections:Department of Mechanical engineering

Files in This Item:
There are no files associated with this item.


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.