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Please use this identifier to cite or link to this item: http://dspace.bits-pilani.ac.in:8080/jspui/xmlui/handle/123456789/12567
Title: Fermi-Level Depinning in Germanium Using Black Phosphorus as an Interfacial Layer
Authors: Rao, V. Ramgopal
Keywords: EEE
Germanium (Ge)
Black phosphorus (BP)
Fermi-level pinning
Tungsten diselenide (WSe₂)
Issue Date: Oct-2019
Publisher: IEEE
Abstract: On substrates such as Ge, GaAs, GaSb, InP and a few other materials, Fermi-level pinning (FLP) is a major concern as it inhibits barrier height modulation (BHM) with different work function metals. We demonstrate for the first time a novel and simple mechanical exfoliation of multilayer black phosphorus (BP) as an interfacial layer (IL) to depin the Fermi level on Ge substrate. Multilayer-BP IL was able to alleviate the critical issue of FLP, as it leads to (i) an increase in reverse current by more than two and a half orders on n-Ge (quasi-Ohmic current-voltage(I-V) characteristics) with a decrease in Schottky barrier height (SBH) of 0.14 eV, and (ii) a decrease in reverse current by two orders on p-Ge (Schottky I-V characteristics) with an increase in SBH of 0.52 eV as compared to devices without IL. The device with multilayer-WSe2 IL, having a high conduction band offset (CBO), leads to poor electrical performance compared to a multilayer-BP IL with low CBO. Based on this study, multilayer-BP can be considered as an ideal candidate for an IL material to resolve FLP issue and achieve BHM for various other pinned semiconductors as well.
URI: https://ieeexplore.ieee.org/document/8798755
http://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12567
Appears in Collections:Department of Electrical and Electronics Engineering

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