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Please use this identifier to cite or link to this item: http://dspace.bits-pilani.ac.in:8080/jspui/xmlui/handle/123456789/12632
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dc.contributor.authorRao, V. Ramgopal-
dc.date.accessioned2023-10-26T06:32:18Z-
dc.date.available2023-10-26T06:32:18Z-
dc.date.issued2014-03-
dc.identifier.urihttps://ieeexplore.ieee.org/document/6727530/authors#authors-
dc.identifier.urihttp://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12632-
dc.description.abstractThis paper presents a new integration scheme to fabricate a Si/Si 0.55 Ge 0.45 heterojunction line tunnel field effect transistor (TFET). The device shows an increase in tunneling current with gate length. The 1- μm gate length device shows on current in excess of 20 μA/μm at VGS=VDS=1.2 V. Low-temperature measurements, performed to suppress trap-assisted tunneling (TAT), reveal the point subthreshold swing as low as 22 mV/dec at 78 K. Field-induced quantum confinement effects are found to increase the tunneling onset voltage by ~ 0.35 V. Variation of the tunneling onset voltage measured experimentally is correlated to variation in the pocket thickness and its doping concentration. Small geometry devices were found to be more susceptible to microvariations in the pocket thickness and doping concentration.en_US
dc.language.isoenen_US
dc.publisherIEEEen_US
dc.subjectEEEen_US
dc.subjectField-induced quantum confinement (FIQC)en_US
dc.subjectFIQC effecten_US
dc.subjectTunnel field effect transistor (TFET)en_US
dc.subjectTFET variabilityen_US
dc.titleFabrication and Analysis of a Si/Si0.55Ge0.45 Heterojunction Line Tunnel FETen_US
dc.typeArticleen_US
Appears in Collections:Department of Electrical and Electronics Engineering

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