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dc.contributor.authorRao, V. Ramgopal-
dc.date.accessioned2023-10-27T10:03:49Z-
dc.date.available2023-10-27T10:03:49Z-
dc.date.issued2010-09-
dc.identifier.urihttps://ieeexplore.ieee.org/document/5518393-
dc.identifier.urihttp://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12680-
dc.description.abstractWe present experimental and simulation studies of shallow trench isolation (STI)-type drain-extended n-channel metal-oxide-semiconductor devices under human body model (HBM)-like electrostatic discharge (ESD) conditions. Physical insight toward pulse-to-pulse instability is given. Both the current ( I TLP ) and time evolution of various events such as junction breakdown, parasitic bipolar triggering, and the base push-out effect are discussed in detail. Differences between the 2-D and 3-D simulation (modeling) approaches are presented, and the importance of 3-D technology-computer-aided-design-based modeling is discussed. Furthermore, a deeper physical insight toward the base push-out is given, which shows significant power dissipation due of space charge build-up, which is found at the onset of self-heating in the 2-D plane.en_US
dc.language.isoenen_US
dc.publisherIEEEen_US
dc.subjectEEEen_US
dc.subjectBase push-outen_US
dc.subjectCharge device model (CDM)en_US
dc.subjectCharge modulationen_US
dc.subjectCurrent filamentationen_US
dc.subjectTransient interferometric mapping (TIM)en_US
dc.titleOn the Behavior of STI-Type DeNMOS Device Under ESD Conditionsen_US
dc.typeArticleen_US
Appears in Collections:Department of Electrical and Electronics Engineering

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