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Please use this identifier to cite or link to this item: http://dspace.bits-pilani.ac.in:8080/jspui/xmlui/handle/123456789/12705
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dc.contributor.authorRao, V. Ramgopal-
dc.date.accessioned2023-10-28T06:56:52Z-
dc.date.available2023-10-28T06:56:52Z-
dc.date.issued2009-02-
dc.identifier.urihttps://ieeexplore.ieee.org/document/4711134-
dc.identifier.urihttp://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12705-
dc.description.abstractWe demonstrate a novel photoplastic nanoelectromechanical device that includes an encapsulated polysilicon piezoresistor. The temperature limitation that typically prevents deposition of polysilicon films on polymers was overcome by employing a hotwire CVD process. In this paper, we report the use of this process to fabricate and characterize a novel polymeric cantilever with an embedded piezoresistor. This device exploits the low Young's modulus of organic polymers and the high gauge factor of polysilicon. The fabricated device fits into the cantilever holder of an atomic force microscope (AFM) and can be used in conjunction with the AFM's liquid cell for detecting the adsorption of biochemicals. It enables differential measurement while preventing biochemicals from interfering with measurements using the piezoresistor. The mechanical and electromechanical characterization of the device is also reported in this paperen_US
dc.language.isoenen_US
dc.publisherIEEEen_US
dc.subjectEEEen_US
dc.subjectAffinity cantileversen_US
dc.subjectBio-microelectromechanical system (bio-MEMS)en_US
dc.subjectHotwire CVD (HWCVD)en_US
dc.subjectPiezoresistive sensingen_US
dc.subjectPolymeric cantileversen_US
dc.titleFabrication and Characterization of a Polymeric Microcantilever With an Encapsulated Hotwire CVD Polysilicon Piezoresistoren_US
dc.typeArticleen_US
Appears in Collections:Department of Electrical and Electronics Engineering

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