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Please use this identifier to cite or link to this item: http://dspace.bits-pilani.ac.in:8080/jspui/xmlui/handle/123456789/12712
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dc.contributor.authorRao, V. Ramgopal-
dc.date.accessioned2023-10-30T06:24:06Z-
dc.date.available2023-10-30T06:24:06Z-
dc.date.issued2008-01-
dc.identifier.urihttps://ieeexplore.ieee.org/document/4408750-
dc.identifier.urihttp://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12712-
dc.description.abstractThe difficulty to fabricate and control precisely defined doping profiles in the source/drain underlap regions of FinFETs necessitates the use of undoped gate underlap regions as the technology scales down. We present a phenomenon called the gate fringe-induced barrier lowering (GFIBL) in FinFETs with undoped underlap regions. In these FinFETs, we show that the GFIBL can be effectively used to improve I on . We propose the use of high-kappa spacers in such FinFETs to enhance the effect of GFIBL and thereby achieve better device and circuit performance. When compared with the underlap FinFETs with Si 3 N 4 spacers, with kappa=20 spacers, we show that it is possible to achieve an 80% increase in I on at iso-I off conditions and a 15% decrease in the inverter delay for a fan-out of four.en_US
dc.language.isoenen_US
dc.publisherIEEEen_US
dc.subjectEEEen_US
dc.subjectCMOS scalingen_US
dc.subjectFinFETen_US
dc.subjectFringe-induced barrier lowering (GFIBL)en_US
dc.subjectShort-channel effects (SCEs)en_US
dc.titleGate Fringe-Induced Barrier Lowering in Underlap FinFET Structures and Its Optimizationen_US
dc.typeArticleen_US
Appears in Collections:Department of Electrical and Electronics Engineering

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