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Please use this identifier to cite or link to this item: http://dspace.bits-pilani.ac.in:8080/jspui/xmlui/handle/123456789/12718
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dc.contributor.authorRao, V. Ramgopal-
dc.date.accessioned2023-10-30T07:01:39Z-
dc.date.available2023-10-30T07:01:39Z-
dc.date.issued2007-04-
dc.identifier.urihttps://ieeexplore.ieee.org/document/4137641-
dc.identifier.urihttp://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12718-
dc.description.abstractThe impact of high-k gate dielectrics on device short-channel and circuit performance of fin field-effect transistors is studied over a wide range of dielectric permittivities k. It is observed that there is a decrease in the parasitic outer fringe capacitance C of in addition to an increase in the internal fringe capacitance C if with high-k dielectrics, which degrades the short-channel effects significantly. It is shown that fin width scaling is the most suitable approach to recover the degradation in the device performance due to high-k integration. Furthermore, from the circuit perspective, for the 32-nm technology generation, the presence of an optimum k for a given target subthreshold leakage current has been identified by various possible approaches such as fin width scaling, fin-doping adjustment, and gate work function engineeringen_US
dc.language.isoenen_US
dc.publisherIEEEen_US
dc.subjectEEEen_US
dc.subjectFin field-effect transistors (FinFETs)en_US
dc.subjectFringing-induced barrier lowering (FIBL)en_US
dc.subjectShort-channel effects (SCEs)en_US
dc.subjectNoise marginen_US
dc.titleImpact of High-k Gate Dielectrics on the Device and Circuit Performance of Nanoscale FinFETsen_US
dc.typeArticleen_US
Appears in Collections:Department of Electrical and Electronics Engineering

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