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dc.contributor.authorRao, V. Ramgopal-
dc.date.accessioned2023-10-30T08:47:13Z-
dc.date.available2023-10-30T08:47:13Z-
dc.date.issued2007-05-
dc.identifier.urihttps://www.sciencedirect.com/science/article/abs/pii/S0956566306004301-
dc.identifier.urihttp://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12720-
dc.description.abstractSU-8 has been primarily used for structural elements and microfludics components in MEMS. Microsystems for biological applications require immobilization of biomolecules on the MEMS structures. In order to functionalize SU-8 for such purposes, the surface needs to be modified. In this paper, we report a novel dry method of surface modification of SU-8 which is compatible with standard microfabrication techniques. The surface obtained by spin coating SU-8 (2002) on silicon wafer was modified by grafting amine groups using pyrolytic dissociation of ammonia in a hotwire CVD setup. To demonstrate the presence of amine groups on modified SU-8 surface, the surface characteristic after modification was assessed using Fourier transform infrared spectroscopy. The change in SU-8 surface morphology before and after surface modification was investigated using atomic force microscopy. To show the utility of this process for application in Bio-MEMS, SU-8 microcantilevers were fabricated and subjected to the same surface modification protocol. Following this, the cantilevers were incubated first in a suspension of human immunoglobulin (HIgG) and then in FITC tagged goat anti-human IgG in order to demonstrate the utility of the surface modification performed. The efficacy of the process was assessed by observing the cantilevers under a fluorescence microscope.en_US
dc.language.isoenen_US
dc.publisherElsevieren_US
dc.subjectEEEen_US
dc.subjectBio-microelectromechanical system (bio-MEMS)en_US
dc.subjectBiomoleculesen_US
dc.titleA novel dry method for surface modification of SU-8 for immobilization of biomolecules in Bio-MEMSen_US
dc.typeArticleen_US
Appears in Collections:Department of Electrical and Electronics Engineering

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