Nano-electro-mechanical transduction and packaging solutions for polymer MEMS devices

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DC Field	Value	Language
dc.contributor.author	Rao, V. Ramgopal	-
dc.date.accessioned	2023-11-02T05:41:36Z	-
dc.date.available	2023-11-02T05:41:36Z	-
dc.date.issued	2015	-
dc.identifier.uri	https://ieeexplore.ieee.org/document/7388668	-
dc.identifier.uri	http://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12800	-
dc.description.abstract	Polymeric micro/nano electromechanical sensors and devices have recently gained much attention over their Si counterparts because of their lower cost and higher sensitivity. In this paper, we have reviewed various reported schemes for nano-electro- mechanical transduction for polymeric sensors particularly for physical, chemical and bio-sensing applications. We have also reviewed the packaging aspects and challenges for these polymeric sensors for various applications.	en_US
dc.language.iso	en	en_US
dc.publisher	IEEE	en_US
dc.subject	EEE	en_US
dc.subject	MEMS	en_US
dc.subject	Polymer	en_US
dc.subject	Micro-cantilever	en_US
dc.subject	Piezoresistive	en_US
dc.subject	ZnO nanowire	en_US
dc.subject	CantiFET	en_US
dc.subject	Packaging	en_US
dc.title	Nano-electro-mechanical transduction and packaging solutions for polymer MEMS devices	en_US
dc.type	Article	en_US
Appears in Collections:	Department of Electrical and Electronics Engineering

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