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dc.contributor.authorRao, V. Ramgopal-
dc.date.accessioned2023-11-02T11:19:51Z-
dc.date.available2023-11-02T11:19:51Z-
dc.date.issued2010-05-
dc.identifier.urihttps://ieeexplore.ieee.org/document/5488723-
dc.identifier.urihttp://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12829-
dc.description.abstractWe present 3D device modeling of RESURF or non-STI type DeNMOS device under ESD conditions. The impact of base push-out, pulse-to-pulse instability and electrical imbalance on the various phases of filamentation is discussed. A new phenomenon called “week NPN action” and the cause of early and fast failure is identified. A modification of the device is proposed which achieved an improvement of ~5X in failure threshold (I T2 ) and ~2X in ESD window without degrading its I/O performance.en_US
dc.language.isoenen_US
dc.publisherIEEEen_US
dc.subjectEEEen_US
dc.subjectDrain-extended MOSFET (DeMOS)en_US
dc.subjectESD Failureen_US
dc.subjectSpace charge buildupen_US
dc.subjectPulse-to-pulse instabilityen_US
dc.titleOn the failure mechanism and current instabilities in RESURF type DeNMOS device under ESD conditionsen_US
dc.typeArticleen_US
Appears in Collections:Department of Electrical and Electronics Engineering

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