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Please use this identifier to cite or link to this item: http://dspace.bits-pilani.ac.in:8080/jspui/xmlui/handle/123456789/12832
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dc.contributor.authorRao, V. Ramgopal-
dc.date.accessioned2023-11-03T04:04:01Z-
dc.date.available2023-11-03T04:04:01Z-
dc.date.issued2009-
dc.identifier.urihttps://ieeexplore.ieee.org/document/5424311-
dc.identifier.urihttp://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12832-
dc.description.abstractFor the first time this paper makes an attempt at predicting the System-on-Chip (SoC) performance (i.e. logic, SRAM, ESD and I/O) of various sub 20 nm channel length planar and non-planar SOI devices using extensive & well calibrated 3D device and mixed-mode TCAD simulations. It has been shown that the non-planar devices such as FinFETs are not the ideal choice for SoC applications and perform poorly in comparison to the Ultra thin body (UTB) planar SOI MOSFETs. We further show different strategies to optimize the planar UTB MOSFETs for improved ESD robustness and I/O performance.en_US
dc.language.isoenen_US
dc.publisherIEEEen_US
dc.subjectEEEen_US
dc.subjectElectrostatic dischargesen_US
dc.subjectFinFETsen_US
dc.subjectRandom access memoryen_US
dc.subjectInvertersen_US
dc.subjectNanoscale devicesen_US
dc.subjectMOSFETsen_US
dc.subjectIntegrated circuit interconnectionsen_US
dc.titleBenchmarking the device performance at sub 22 nm node technologies using an SoC frameworken_US
dc.typeArticleen_US
Appears in Collections:Department of Electrical and Electronics Engineering

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