Please use this identifier to cite or link to this item:
http://dspace.bits-pilani.ac.in:8080/jspui/xmlui/handle/123456789/12848| Title: | Photoplastic NEMS with an Encapsulated Polysilicon Piezoresistor |
| Authors: | Rao, V. Ramgopal |
| Keywords: | EEE Electrical resistance measurement Substrates Polymers Voltage measurement Distance measurement |
| Issue Date: | 2008 |
| Publisher: | IEEE |
| Abstract: | We demonstrate a photoplastic NEMS device that has an encapsulated polysilicon piezoresistor. The crucial temperature limitation of depositing a polysilicon film on a polymer was overcome by employing a novel Hotwire CVD process. In this paper, we report the fabrication and characterization of a novel polymeric cantilever with an embedded piezoresistor, which exploits the low Youngs modulus of a polymer and high gauge factor of polysilicon. Such devices are widely used for sensing biochemicals. |
| URI: | https://ieeexplore.ieee.org/document/4617122 http://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12848 |
| Appears in Collections: | Department of Electrical and Electronics Engineering |
Files in This Item:
There are no files associated with this item.
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.