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Please use this identifier to cite or link to this item: http://dspace.bits-pilani.ac.in:8080/jspui/xmlui/handle/123456789/12853
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dc.contributor.authorRao, V. Ramgopal-
dc.date.accessioned2023-11-03T11:01:19Z-
dc.date.available2023-11-03T11:01:19Z-
dc.date.issued2007-
dc.identifier.urihttps://ieeexplore.ieee.org/document/4378080-
dc.identifier.urihttp://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12853-
dc.description.abstractIt is shown that body doping can be used to match the Bulk FinFETs' DC performance with that of SOI FinFETs, even down to 22 nm technology node, by using calibrated full 3D device simulations. However higher body doping does not necessarily mean better performance always as there is a optimum body doping. The optimum doping should be carefully chosen such that device exhibits no punch through and no BTBT leakage currents. Thus careful body doping optimization is critical for the reliable device operation of novel Bulk FinFET structures.en_US
dc.language.isoenen_US
dc.publisherIEEEen_US
dc.subjectEEEen_US
dc.subjectFinFETsen_US
dc.subjectDoping profilesen_US
dc.subjectThermal conductivityen_US
dc.subjectSemiconductor process modelingen_US
dc.subjectGuidelinesen_US
dc.subjectQuantizationen_US
dc.titleImproving the DC performance of Bulk FinFETs by Optimum Body Dopingen_US
dc.typeArticleen_US
Appears in Collections:Department of Electrical and Electronics Engineering

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