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Title: Analog Device and Circuit Performance Degradation under Substrate Enhanced Hot Carrier Stress Conditions
Authors: Rao, V. Ramgopal
Keywords: EEE
Analog Performance Degradation
Substrate Enhanced HCI
Forward Body Biasing (FBB) Scheme
Auger recombination
Issue Date: 2006
Publisher: IEEE
Abstract: In this paper, we investigate the influence of forward and reverse body bias stress on the hot carrier induced degradation of MOS analog performance parameters. The underlying physical mechanisms are identified with the help of experimental results, TCAD and Monte-Carlo simulations. We show that under forward body bias stress conditions, the auger recombination enhanced hot carrier injection (HCI) degrades the device and circuit performance considerably. Degradation in various analog circuits’ performance is quantified by considering the individual transistors under different stress conditions.
URI: https://ieeexplore.ieee.org/iel5/4017118/4017119/04017204.pdf
http://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12858
Appears in Collections:Department of Electrical and Electronics Engineering

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