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Please use this identifier to cite or link to this item: http://dspace.bits-pilani.ac.in:8080/jspui/xmlui/handle/123456789/12889
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dc.contributor.authorRao, V. Ramgopal-
dc.date.accessioned2023-11-07T06:40:59Z-
dc.date.available2023-11-07T06:40:59Z-
dc.date.issued2001-
dc.identifier.issn0277-786X-
dc.identifier.urihttp://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12889-
dc.description.abstractThe performance of Jet Vapour Deposited (JVD) Silicon Nitride devices under high field stressing is reported in this paper. Border traps were generated when n-substrate capacitors were stressed with negative gate voltages. Also, an increase in bulk positive charges as well as interface trap density was observed. These results indicate that stressing under negative gate voltages may cause long term reliability problems in Metal-Nitride-Semiconductor (MNS) devices'. Stressing with positive gate voltage, however, does not show any significant degradation.en_US
dc.language.isoenen_US
dc.publisherSPIEen_US
dc.subjectEEEen_US
dc.subjectBorder trapsen_US
dc.subjectInterfaceen_US
dc.subjectOxidesen_US
dc.subjectRadiationen_US
dc.subjectBiasen_US
dc.titleHigh Field Stressing Effects in JVD Nitride Capacitorsen_US
dc.typeArticleen_US
Appears in Collections:Department of Electrical and Electronics Engineering

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