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dc.contributor.authorRao, V. Ramgopal-
dc.date.accessioned2023-11-07T09:34:46Z-
dc.date.available2023-11-07T09:34:46Z-
dc.date.issued2000-
dc.identifier.urihttps://ieeexplore.ieee.org/document/911895-
dc.identifier.urihttp://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12898-
dc.description.abstractSOI MNSFETs with channel lengths down to 100 nm and having a Jet Vapor Deposited (JVD) silicon nitride (Si/sub 3/N/sub 4/) gate dielectric are fabricated and characterized. The JVD MNSFETs show comparable performance in comparison to conventional SiO/sub 2/ SOI-MOSFETs, in terms of low gate leakage, Si/sub 3/N/sub 4//Si interface quality and I/sub on//I/sub off/ ratio. In addition, the MNSFETs show better hot carrier reliability compared to conventional MOSFETs. Our results explore the worthiness of JVD Si/sub 3/N/sub 4/ as gate dielectric for future low power ULSI applications.en_US
dc.language.isoenen_US
dc.publisherIEEEen_US
dc.subjectEEEen_US
dc.subjectMOSFETsen_US
dc.subjectGate leakageen_US
dc.subjectHot carriersen_US
dc.subjectTransconductanceen_US
dc.subjectThickness measurementen_US
dc.subjectSiliconen_US
dc.titleReliability studies on sub 100 nm SOI-MNSFETsen_US
dc.typeArticleen_US
Appears in Collections:Department of Electrical and Electronics Engineering

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