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dc.contributor.authorRao, V. Ramgopal-
dc.date.accessioned2023-11-07T10:35:24Z-
dc.date.available2023-11-07T10:35:24Z-
dc.date.issued1999-
dc.identifier.urihttp://ieeexplore.ieee.org/iel5/10061/32274/01505572.pdf-
dc.identifier.urihttp://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12902-
dc.description.abstractMetal-Nitride-Semiconductor f"'En:" with channel lengths down to 100 nm and a novel .leI Vapor f)eposited (JVD) SiN gate dielectric are fabricated and characterized for their hot-carrier reliability. A novel charge pumping technique is employed to characterize the stress induced interface degradation (?f such MN5WETs' in comparison to MOSJ-1n:\, having thermal Si(h gale oxide. Under identical substrate current during stress, MNSFE1's show less inte1jcu:e-state generation and resulting drain current degradation jbr various channel lengths, stress time and supply voltage. The time and vollage dependence of hot-carrier degradation has been found (0 he distinctly d􀁮tferent for MN.)'F'ETs compared (0 conventional Si02 MOSFET'i.en_US
dc.language.isoenen_US
dc.publisherIEEEen_US
dc.subjectEEEen_US
dc.subjectPumping techniqueen_US
dc.subjectMetal-Nitride-Semiconductoren_US
dc.titleHot-Carrier Induced Interface Degradation in Jet Vapor Deposited SiN MNSFETs as Studied by a Novel Charge Pumping Techniqueen_US
dc.typeArticleen_US
Appears in Collections:Department of Electrical and Electronics Engineering

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