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Please use this identifier to cite or link to this item: http://dspace.bits-pilani.ac.in:8080/jspui/handle/123456789/13111
Title: An experimental study on heat power stored by thermal dissipation in electronic components using thermosyphon integrated hybrid nanocomposite phase change material
Authors: Parameshwaran, R.
Keywords: Mechanical Engineering
Polymer nanocomposites
Electronic components
Thermal dissipation
Issue Date: Nov-2023
Publisher: Elsevier
Abstract: This study investigates the heat power stored by the thermal dissipation of electronic components using a thermosyphon integrated hybrid nanocomposite phase change material storage system. The study examines various thermal performances including the percentage of thermal dissipation, thermal resistance and heat transfer coefficient using benzene, deionized water, methanol and methyl acetate as heat transfer fluids, with an intended heat input of 50 – 120 W. The 0.5 wt% copper-titania hybrid nanocomposite particles are dispersed with phase change material (methyl cinnamate) and chosen as hybrid nanocomposite phase change material. The assessment of charging and retrieving characteristics of stored hybrid nanocomposite phase change material has been done by the impact of heat transfer fluids flowing through the copper tube at the different heat inputs. The result findings show that methyl acetate has the maximum percentage of thermal dissipation, low thermal resistance and high heat transfer coefficient of about 99.2 %, 0.311 K/W and 242.36 W/(m2.K) respectively at 120 W. The obtained results are attributed to the low boiling point and enthalpy of vapourization of methyl acetate. The highest heat power stored by hybrid nanocomposite phase change material is discovered as 6.5 W during melting by the impact of vapourized methyl acetate at maximum heat input owing to the higher mass flow rate and lesser time to attain steady state temperature of hybrid nanocomposite phase change material. Also, the developed system promotes thermal management in electronic components along with a minimum power saving of about 5–6 %.
URI: https://www.sciencedirect.com/science/article/abs/pii/S2352152X23020273
http://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/13111
Appears in Collections:Department of Mechanical engineering

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