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dc.contributor.authorGangopadhyay, Subhashis-
dc.date.accessioned2024-03-06T04:34:12Z-
dc.date.available2024-03-06T04:34:12Z-
dc.date.issued2000-
dc.identifier.urihttps://iopscience.iop.org/article/10.1088/0957-0233/11/10/302/meta-
dc.identifier.urihttp://dspace.bits-pilani.ac.in:8080/jspui/xmlui/handle/123456789/14533-
dc.description.abstractAn experimental set-up involving a combination of reverse electrochemical etching and the floating-layer technique of tip preparation is presented. In the model only dc bias is used, avoiding the shortcomings of ac bias. The collection of two tips in a single etching process and mechanical auto-breaking of the circuit are emphasized. This cost and time effective, easy in-laboratory approach yields two sharp tips without paying attention to switching off the circuit. The nature of the tip shape arising from the floating-layer technique has been explained in terms of the electrical field distribution between the electrodes. The addition of some new information together with a few established facts will enrich and enlighten the art of tip preparation.en_US
dc.language.isoenen_US
dc.publisherIOPen_US
dc.subjectPhysicsen_US
dc.subjectElectrochemical floating-layer techniqueen_US
dc.subjectSPMen_US
dc.title100 year anniversary Measurement Science and Technology logo. Purpose-led Publishing logo. A reverse electrochemical floating-layer technique of SPM tip preparationen_US
dc.typeArticleen_US
Appears in Collections:Department of Physics

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