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dc.contributor.authorRano, Dinesh-
dc.date.accessioned2024-05-10T05:56:01Z-
dc.date.available2024-05-10T05:56:01Z-
dc.date.issued2017-
dc.identifier.urihttps://ieeexplore.ieee.org/abstract/document/8449666-
dc.identifier.urihttp://dspace.bits-pilani.ac.in:8080/jspui/xmlui/handle/123456789/14798-
dc.description.abstractIn this paper, design of a miniaturized 3-stage impedance matching network capable of providing good match at two Wi-Fi frequencies of 2.4GHz and 5.8GHz is presented. The proposed technique can provide matching between complex loads and real source at the two chosen frequencies. This technique is able to reduce the circuit size by 50% and 35% when compared to the state-of-the-art 3-stage dual-band impedance matching network at the frequencies of 2.4GHz and 5.8GHz respectively. In addition, the technique can inherently provide wideband matching at both the identified frequencies. For the two chosen frequencies, the increase in bandwidth is 23% and 77% respectively. A prototype developed, on FR4 substrate, provides good agreement between the simulated and measured results.en_US
dc.language.isoenen_US
dc.publisherIEEEen_US
dc.subjectEEEen_US
dc.subjectImpedanceen_US
dc.subjectBandwidthen_US
dc.subjectDual banden_US
dc.subjectPower Transmission Linesen_US
dc.subjectPrototypesen_US
dc.subjectLoss Measurementen_US
dc.subjectImpedance Matchingen_US
dc.titleA Miniaturized Three-Stage Dual-Frequency Matching Networken_US
dc.typeArticleen_US
Appears in Collections:Department of Electrical and Electronics Engineering

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