DSpace logo

Please use this identifier to cite or link to this item: http://dspace.bits-pilani.ac.in:8080/jspui/handle/123456789/16755
Title: Flexible Silicon: Status, Opportunities, and Challenges
Authors: Gupta, Navneet
Keywords: EEE
Flexible Electronics
Flexible silicon
Ultra-thin chips fabrication
Progression
Issue Date: Sep-2024
Publisher: IEEE
Abstract: The rise of the Internet of Everything has spurred the need for flexible and stretchable electronic devices, particularly in biomedical applications. Monocrystalline silicon, a key material in the semiconductor industry, must be adapted to meet these demands. This article explores various thinning techniques to fabricate flexible silicon wafers, methods for transferring silicon to flexible substrates, and the importance of enhancing silicon’s stretchability. Furthermore, it discusses the impact of flexible silicon on sectors such as biomedical sensing, electronics, and power systems, highlighting the role of the Internet of Things (IoT) platform in interconnecting devices. Finally, the article examines current progress and future prospects in flexible silicon technology, paving the way for further advancements in this rapidly evolving field.
URI: https://ieeexplore.ieee.org/abstract/document/10663398
http://dspace.bits-pilani.ac.in:8080/jspui/handle/123456789/16755
Appears in Collections:Department of Electrical and Electronics Engineering

Files in This Item:
There are no files associated with this item.


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.