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dc.contributor.authorGupta, Navneet-
dc.date.accessioned2025-01-08T11:20:05Z-
dc.date.available2025-01-08T11:20:05Z-
dc.date.issued2024-09-
dc.identifier.urihttps://ieeexplore.ieee.org/abstract/document/10663398-
dc.identifier.urihttp://dspace.bits-pilani.ac.in:8080/jspui/handle/123456789/16755-
dc.description.abstractThe rise of the Internet of Everything has spurred the need for flexible and stretchable electronic devices, particularly in biomedical applications. Monocrystalline silicon, a key material in the semiconductor industry, must be adapted to meet these demands. This article explores various thinning techniques to fabricate flexible silicon wafers, methods for transferring silicon to flexible substrates, and the importance of enhancing silicon’s stretchability. Furthermore, it discusses the impact of flexible silicon on sectors such as biomedical sensing, electronics, and power systems, highlighting the role of the Internet of Things (IoT) platform in interconnecting devices. Finally, the article examines current progress and future prospects in flexible silicon technology, paving the way for further advancements in this rapidly evolving field.en_US
dc.language.isoenen_US
dc.publisherIEEEen_US
dc.subjectEEEen_US
dc.subjectFlexible Electronicsen_US
dc.subjectFlexible siliconen_US
dc.subjectUltra-thin chips fabricationen_US
dc.subjectProgressionen_US
dc.titleFlexible Silicon: Status, Opportunities, and Challengesen_US
dc.typeArticleen_US
Appears in Collections:Department of Electrical and Electronics Engineering

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