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http://dspace.bits-pilani.ac.in:8080/jspui/handle/123456789/16761| Title: | Envelope retrofits for enhancing thermal comfort in Indian residences against the backdrop of global warming |
| Authors: | Ukey, Rahul |
| Keywords: | Mechanical engineering Envelope retrofit Thermal comfort |
| Issue Date: | 2023 |
| Publisher: | BITS PILANI, Pilani campus |
| Description: | Under the Supervision of Dr. Aakash Chand Rai and Prof. Shyam Sunder Yadav |
| URI: | http://hdl.handle.net/10603/581532 |
| Appears in Collections: | Department of Mechanical engineering |
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