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Please use this identifier to cite or link to this item: http://dspace.bits-pilani.ac.in:8080/jspui/handle/123456789/16761
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dc.contributor.authorUkey, Rahul-
dc.date.accessioned2025-01-10T09:38:14Z-
dc.date.available2025-01-10T09:38:14Z-
dc.date.issued2023-
dc.identifier.urihttp://dspace.bits-pilani.ac.in:8080/jspui/handle/123456789/16761-
dc.descriptionUnder the Supervision of Dr. Aakash Chand Rai and Prof. Shyam Sunder Yadaven_US
dc.language.isoenen_US
dc.publisherBITS PILANI, Pilani campusen_US
dc.subjectMechanical engineeringen_US
dc.subjectEnvelope retrofiten_US
dc.subjectThermal comforten_US
dc.titleEnvelope retrofits for enhancing thermal comfort in Indian residences against the backdrop of global warmingen_US
dc.typeThesisen_US
Appears in Collections:Department of Mechanical engineering

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