Please use this identifier to cite or link to this item:
http://dspace.bits-pilani.ac.in:8080/jspui/handle/123456789/16761| Title: | Envelope retrofits for enhancing thermal comfort in Indian residences against the backdrop of global warming |
| Authors: | Ukey, Rahul |
| Keywords: | Mechanical engineering Envelope retrofit Thermal comfort |
| Issue Date: | 2023 |
| Publisher: | BITS PILANI, Pilani campus |
| Description: | Under the Supervision of Dr. Aakash Chand Rai and Prof. Shyam Sunder Yadav |
| URI: | http://dspace.bits-pilani.ac.in:8080/jspui/handle/123456789/16761 |
| Appears in Collections: | Department of Mechanical engineering |
Files in This Item:
| File | Description | Size | Format | |
|---|---|---|---|---|
| Th_Rahul Ukey.pdf | 6.72 MB | Adobe PDF | View/Open |
Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.