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Issue Date
Title
Author(s)
2015-10
Part II: A Fully Integrated RF PA in 28-nm CMOS With Device Design for Optimized Performance and ESD Robustness
Rao, V. Ramgopal
2015-09
A Fully Integrated RF PA in 28nm CMOS with Device Design for Optimized Performance and ESD Robustness
Rao, V. Ramgopal
2012-05
Physical Insight Toward Heat Transport and an Improved Electrothermal Modeling Framework for FinFET Architectures
Rao, V. Ramgopal
2009
A new physical insight and 3D device modeling of STI type denmos device failure under ESD conditions
Rao, V. Ramgopal
2015-10
Comparison of breakdown characteristics of DeNMOS devices with various drain structures
Rao, V. Ramgopal
2011
On the thermal failure in nanoscale devices: Insight towards heat transport including critical BEOL and design guidelines for robust thermal management & EOS/ESD reliability
Rao, V. Ramgopal
2010
On the Transient behavior of various drain extended MOS devices under the ESD stress condition
Rao, V. Ramgopal
2010-11
3D TCAD based approach for the evaluation of nanoscale devices during ESD failure
Rao, V. Ramgopal
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Author
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Rao, V. Ramgopal
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EEE
3
Shallow-trench-isolation (STI)
2
BEOL reliability
2
CMOS technologies
2
Device-circuit codesign
2
System-on-chip (SoC)
1
Base push-out
1
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1
CMOS technology
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