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Please use this identifier to cite or link to this item: http://dspace.bits-pilani.ac.in:8080/jspui/handle/123456789/19281
Title: Unveiling the future: A comprehensive analysis of 6G technology and its transformative potential
Authors: Chamola, Vinay
Keywords: EEE
6G mobile communication
Terahertz (THz) and ultra-massive MIMO
Machine learning (ML)
Deep learning (DL)
Network slicing and adaptive security
Issue Date: Jun-2025
Publisher: Springer
Abstract: Sixth-generation (6G) technology signifies a major leap in mobile communications, offering ultra-reliable, low-latency, and high-throughput connectivity. This review investigates the foundational technologies underpinning 6G, including Terahertz (THz) communication and ultra-massive multiple input, multiple output (MIMO), and explores their capabilities in enabling high-speed, consistent, and scalable communication infrastructures. A key focus of this study is the application of machine learning (ML) and deep learning (DL) in optimizing network slicing and addressing security challenges within 6G networks. While network slicing allows for flexible, service-specific logical network partitions, it also introduces technical challenges such as dynamic resource allocation, secure slice isolation, and real-time threat detection. To mitigate these, we assess ML-driven approaches—including reinforcement learning (RL), federated learning, and anomaly detection models—that facilitate intelligent orchestration and adaptive security. Furthermore, we highlight practical deployment barriers such as data privacy concerns, computational limitations at the edge, and the need for interpretable models and standardization. This comprehensive review provides insights into the current state, challenges, and potential solutions for integrating ML-based mechanisms to enhance the efficiency, scalability, and security of next-generation communication systems.
URI: https://link.springer.com/article/10.1007/s11235-025-01323-w
http://dspace.bits-pilani.ac.in:8080/jspui/handle/123456789/19281
Appears in Collections:Department of Electrical and Electronics Engineering

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