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Please use this identifier to cite or link to this item: http://dspace.bits-pilani.ac.in:8080/jspui/handle/123456789/19738
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dc.contributor.authorMishra, Radha Raman-
dc.date.accessioned2025-10-11T05:00:25Z-
dc.date.available2025-10-11T05:00:25Z-
dc.date.issued2024-
dc.identifier.urihttps://www.sciencedirect.com/science/article/pii/S2214785323050101-
dc.identifier.urihttp://dspace.bits-pilani.ac.in:8080/jspui/handle/123456789/19738-
dc.description.abstractMicrowave joining is an emerging technique for the joining of metallic materials because it can join metals faster and offers uniform heating. The current work studies the multi-physics simulation of a microwave-joined Hastelloy C-276 plate with Inconel 718 interface powder inside a multimode microwave applicator at 2.45 GHz and 900 W. The distribution of electric field, temperature, and thermal stress in the joint were analyzed to understand the microwave-joined Hastelloy C-276 plates. The results revealed that the maximum values of electric field strength and temperature at the central plane of symmetry were 7.4 × 104 V/m and 1.43 × 103 ⁰C, respectively. The maximum thermal stress (1.37 × 109N/m2) was estimated using von-Mises criterion. Resistive losses were found to be maximum i.e., 2.72 × 108 W/m3 at the ends of the graphite plate. The study determined the optimum parameters for microwave joining of Hastelloy C-276 plates.en_US
dc.language.isoenen_US
dc.publisherElsevieren_US
dc.subjectMechanical engineeringen_US
dc.subjectMicrowave joiningen_US
dc.subjectHastelloy C-276en_US
dc.subjectInconel 718en_US
dc.subjectElectric field distributionen_US
dc.subjectTemperature distributionen_US
dc.titleNumerical simulation study on microwave joining of Hastelloy C-276 plates using Inconel-718 interface powderen_US
dc.typeArticleen_US
Appears in Collections:Department of Mechanical engineering

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