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Please use this identifier to cite or link to this item: http://dspace.bits-pilani.ac.in:8080/jspui/handle/123456789/19763
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dc.contributor.authorBelgamwar, Sachin U.-
dc.date.accessioned2025-10-14T16:40:42Z-
dc.date.available2025-10-14T16:40:42Z-
dc.date.issued2025-04-
dc.identifier.urihttps://link.springer.com/article/10.1007/s42791-025-00094-4-
dc.identifier.urihttp://dspace.bits-pilani.ac.in:8080/jspui/handle/123456789/19763-
dc.description.abstractAs the power requirements of industrial and electronic equipment continue to increase, thermal management is becoming more and more important. BHT, or pool boiling heat transfer, is acknowledged as an effective technique for handling large heat loads. In this study, experimental work on pool BHT is conducted on a surface coated with porous Cu and R-141b. The porous coating is achieved using two-stage electrodeposition techniques on a plain Cu surface. Characterization results reveal that the copper coating consists of a combination of nano- and microporous structures. Experimental studies have shown that the presence of a Cu-coated surface significantly enhances the Heat Transfer Coefficient (HTC) by up to 53% compared to a surface coated only with Cu. Additionally, the Cu-coated surface reduces heat compared to the uncoated surface. These findings demonstrate that the porous Cu coating surface can effectively increase surface area, cavitation, and nucleation density, which are beneficial for heat transfer applications.en_US
dc.language.isoenen_US
dc.publisherSpringeren_US
dc.subjectMechanical engineeringen_US
dc.subjectPool boiling heat transfer (BHT)en_US
dc.subjectPorous copper coatingen_US
dc.subjectHeat transfer enhancementen_US
dc.subjectNano-microporous surfacesen_US
dc.titlePool boiling heat transfer enhancement on micro- and nano-structured copper surfaceen_US
dc.typeArticleen_US
Appears in Collections:Department of Mechanical engineering

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