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dc.contributor.authorBhattacharyya, Suvanjan-
dc.date.accessioned2025-10-23T04:22:29Z-
dc.date.available2025-10-23T04:22:29Z-
dc.date.issued2025-04-
dc.identifier.urihttps://link.springer.com/article/10.1007/s10973-025-14180-1-
dc.identifier.urihttp://dspace.bits-pilani.ac.in:8080/jspui/handle/123456789/19874-
dc.description.abstractThis study explores the use of vortex generators, specifically ribs, in a 40 mm × 4 mm minichannel to enhance electronics devices and data center cooling using 2% Fe3O4/water nanofluid under different magnetic fields. Two rib configurations—parallel and staggered—were tested under uniform magnetic fields ranging from 800 to 2000G, generated by magnets placed 15 mm and 25 mm from the fluid domain inlet, individually and combined. Various Reynolds numbers (Re) from 50 to 250 were investigated. Results showed the highest Nusselt number (Nu) enhancement occurred with both magnets combined at 2000G, yielding increases of 100.63% for the parallel and 73.16% for the staggered configuration. The maximum Colburn j factor enhancement was 128% and 109% for the parallel and staggered configurations, respectively. The friction factor (f) decreased with increasing Re but increased with higher magnetic field strengths. The thermal enhancement factor (TEF) consistently exceeded 1, peaking at 2.61 for the parallel and 2.05 for the staggered configuration. This study demonstrates the potential of magnetic nanofluids under magnetic fields for industrial applications such as electronic device cooling, data center cooling and solar PV panel cooling.en_US
dc.language.isoenen_US
dc.publisherSpringeren_US
dc.subjectMechanical engineeringen_US
dc.subjectVortex generatorsen_US
dc.subjectNanoscale coolingen_US
dc.subjectMagnetic nanofluidsen_US
dc.subjectNusselt number enhancementen_US
dc.subjectThermal enhancement factor (TEF)en_US
dc.titleNumerical analysis of magnetic nanofluid flow in electronic cooling systems under magnetic influenceen_US
dc.typeArticleen_US
Appears in Collections:Department of Mechanical engineering

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