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| DC Field | Value | Language |
|---|---|---|
| dc.contributor.author | Dalvi, Anshuman | - |
| dc.date.accessioned | 2025-11-17T06:46:29Z | - |
| dc.date.available | 2025-11-17T06:46:29Z | - |
| dc.date.issued | 2025-04 | - |
| dc.identifier.uri | https://iopscience.iop.org/article/10.1088/2631-8695/adcf77/meta | - |
| dc.identifier.uri | http://dspace.bits-pilani.ac.in:8080/jspui/handle/123456789/20062 | - |
| dc.description.abstract | The reliability of microelectromechanical system (MEMS) based piezoelectric acoustic sensors is important for a wide range of applications for environmental monitoring, medical diagnostics, and aerospace perspectives. These sensors must have long-term durability and stable performance under a variety of environmental conditions. This article includes a comprehensive framework for assessing the reliability of MEMS piezoelectric acoustic sensors with a focus on mechanical, electrical and thermal stability. The device comprises a zinc oxide layer (ZnO) between two metal electrodes, with a thin silicon dioxide film and micropaths worn on a glass substrate. The sensitivity and resonance frequency for this device were obtained at 203 μV/Pa and 78.9 kHz, respectively. The most critical factors evaluated include layer adhesion, substrate bonding strength of 8.9 MPa, a current bearing capacity of 91 mA, and thermal handling ability up to 600 °C. All of these aspects are important for determining the robustness and consistency of the sensor in performance. | en_US |
| dc.language.iso | en | en_US |
| dc.publisher | IOP | en_US |
| dc.subject | Physics | en_US |
| dc.subject | MEMS acoustic sensors | en_US |
| dc.subject | Piezoelectric reliability | en_US |
| dc.subject | ZnO thin film | en_US |
| dc.subject | Thermal stability | en_US |
| dc.title | Fabrication and reliability testing of a MEMS piezoelectric acoustic sensor for applications in harsh environments | en_US |
| dc.type | Article | en_US |
| Appears in Collections: | Department of Physics | |
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