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Please use this identifier to cite or link to this item: http://dspace.bits-pilani.ac.in:8080/jspui/handle/123456789/20062
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dc.contributor.authorDalvi, Anshuman-
dc.date.accessioned2025-11-17T06:46:29Z-
dc.date.available2025-11-17T06:46:29Z-
dc.date.issued2025-04-
dc.identifier.urihttps://iopscience.iop.org/article/10.1088/2631-8695/adcf77/meta-
dc.identifier.urihttp://dspace.bits-pilani.ac.in:8080/jspui/handle/123456789/20062-
dc.description.abstractThe reliability of microelectromechanical system (MEMS) based piezoelectric acoustic sensors is important for a wide range of applications for environmental monitoring, medical diagnostics, and aerospace perspectives. These sensors must have long-term durability and stable performance under a variety of environmental conditions. This article includes a comprehensive framework for assessing the reliability of MEMS piezoelectric acoustic sensors with a focus on mechanical, electrical and thermal stability. The device comprises a zinc oxide layer (ZnO) between two metal electrodes, with a thin silicon dioxide film and micropaths worn on a glass substrate. The sensitivity and resonance frequency for this device were obtained at 203 μV/Pa and 78.9 kHz, respectively. The most critical factors evaluated include layer adhesion, substrate bonding strength of 8.9 MPa, a current bearing capacity of 91 mA, and thermal handling ability up to 600 °C. All of these aspects are important for determining the robustness and consistency of the sensor in performance.en_US
dc.language.isoenen_US
dc.publisherIOPen_US
dc.subjectPhysicsen_US
dc.subjectMEMS acoustic sensorsen_US
dc.subjectPiezoelectric reliabilityen_US
dc.subjectZnO thin filmen_US
dc.subjectThermal stabilityen_US
dc.titleFabrication and reliability testing of a MEMS piezoelectric acoustic sensor for applications in harsh environmentsen_US
dc.typeArticleen_US
Appears in Collections:Department of Physics

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