DSpace logo

Please use this identifier to cite or link to this item: http://dspace.bits-pilani.ac.in:8080/jspui/handle/123456789/2684
Full metadata record
DC FieldValueLanguage
dc.contributor.authorEtika, Krishna Chitanya-
dc.date.accessioned2021-10-08T12:31:36Z-
dc.date.available2021-10-08T12:31:36Z-
dc.date.issued2009-
dc.identifier.urihttps://nanocomposites.tamu.edu/research/the-influence-of-synergistic-stabilization-of-carbon-black-and-clay-on-the-electrical-and-mechanical-properties-of-epoxy-composites-
dc.identifier.urihttp://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/2684-
dc.description.abstractStudies of acetone-based suspensions suggest a synergistic stabilization of clay by carbon black (CB) that involves a haloing effect (i.e., CB surrounding clay). This unique microstructural development ultimately influences the electrical and mechanical properties of epoxy composites that contain both particles. With the addition of 0.5 wt.% clay, electrical conductivity increases by an order of magnitude for CB filled epoxy (relative to composites containing no clay), but no significant improvement is observed in storage modulus. Composites containing equal concentrations of CB and clay show reduced electrical conductivity, but significant improvement in storage modulus (relative to the composites containing equal amount (wt.%) of either CB or clay alone). Both electrical conductivity and storage modulus improve in composites containing a 1:2 clay:CB (wt/wt) ratio. This synergy between CB and clay is a useful tool for simultaneously improving the electrical and mechanical properties of solution-processed composites.en_US
dc.language.isoenen_US
dc.publisherElsieveren_US
dc.subjectChemical Engineeringen_US
dc.subjectSynergistic stabilizationen_US
dc.subjectCarbon blacken_US
dc.subjectepoxy Compositesen_US
dc.titleThe influence of synergistic stabilization of carbon black and clay on the electrical and mechanical properties of epoxy compositesen_US
dc.typeArticleen_US
Appears in Collections:Department of Chemical Engineering

Files in This Item:
There are no files associated with this item.


Items in DSpace are protected by copyright, with all rights reserved, unless otherwise indicated.