Material selection for microelectronic heat sinks: An application of the Ashby approach

Please use this identifier to cite or link to this item: http://dspace.bits-pilani.ac.in:8080/jspui/xmlui/handle/123456789/9007

Full metadata record

DC Field	Value	Language
dc.contributor.author	Gupta, Navneet	-
dc.date.accessioned	2023-02-06T10:52:27Z	-
dc.date.available	2023-02-06T10:52:27Z	-
dc.date.issued	2010-01	-
dc.identifier.uri	https://www.sciencedirect.com/science/article/pii/S0261306909003549	-
dc.identifier.uri	http://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/9007	-
dc.description.abstract	This paper focuses on optimal materials selection for microelectronic heat sinks to maximize the thermal, mechanical and electronic response based on electro-thermal heat transfer analysis using the Ashby approach. In this work, material indices have been developed for a number of properties of heat sinks supported by materials selection tables/graphs. It is found that aluminum based alloys/metals perform better than other available materials for microelectronic heat sinks.	en_US
dc.language.iso	en	en_US
dc.publisher	Elsevier	en_US
dc.subject	EEE	en_US
dc.subject	Heat sink	en_US
dc.subject	Ashby's approach	en_US
dc.subject	Heat transfer	en_US
dc.subject	Materials selection	en_US
dc.subject	MICROELECTROMECHANICAL systems	en_US
dc.title	Material selection for microelectronic heat sinks: An application of the Ashby approach	en_US
dc.type	Article	en_US
Appears in Collections:	Department of Electrical and Electronics Engineering

Files in This Item:

There are no files associated with this item.