Abstract:
Copper (Cu) is the most widely used as a cost-effective material in electronic industries due to its high electrical and thermal conductivity along with good ductility. However, the low mechanical strength of the pure form of Cu limits its applications. Cu-graphene nanoplatelets (Cu-GNPs) composites could be implemented as structural materials for electrical power generation, transmission, and distribution where high mechanical strength is required. In this research, GNPs reinforced Cu matrix composite was fabricated using electro-co-deposition and powder metallurgy. The Cu-GNPs composite powder was characterized by field emission scanning electron microscopy (FESEM) and X-ray diffraction (XRD) to study the effect of GNPs incorporation on the surface morphology and crystallite size. Sintered samples fabricated from Cu-GNPs composite powder shows improved hardness and mechanical strength as compared to pure Cu. The improved hardness and mechanical strength of Cu-GNPs composite depend on the gr