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Fabrication and Analysis of a Si/Si0.55Ge0.45 Heterojunction Line Tunnel FET

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dc.contributor.author Rao, V. Ramgopal
dc.date.accessioned 2023-10-26T06:32:18Z
dc.date.available 2023-10-26T06:32:18Z
dc.date.issued 2014-03
dc.identifier.uri https://ieeexplore.ieee.org/document/6727530/authors#authors
dc.identifier.uri http://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12632
dc.description.abstract This paper presents a new integration scheme to fabricate a Si/Si 0.55 Ge 0.45 heterojunction line tunnel field effect transistor (TFET). The device shows an increase in tunneling current with gate length. The 1- μm gate length device shows on current in excess of 20 μA/μm at VGS=VDS=1.2 V. Low-temperature measurements, performed to suppress trap-assisted tunneling (TAT), reveal the point subthreshold swing as low as 22 mV/dec at 78 K. Field-induced quantum confinement effects are found to increase the tunneling onset voltage by ~ 0.35 V. Variation of the tunneling onset voltage measured experimentally is correlated to variation in the pocket thickness and its doping concentration. Small geometry devices were found to be more susceptible to microvariations in the pocket thickness and doping concentration. en_US
dc.language.iso en en_US
dc.publisher IEEE en_US
dc.subject EEE en_US
dc.subject Field-induced quantum confinement (FIQC) en_US
dc.subject FIQC effect en_US
dc.subject Tunnel field effect transistor (TFET) en_US
dc.subject TFET variability en_US
dc.title Fabrication and Analysis of a Si/Si0.55Ge0.45 Heterojunction Line Tunnel FET en_US
dc.type Article en_US


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