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Fabrication of La0.7Sr0.3MnO3–Si Heterojunctions Using a CMOS-Compatible Citric Acid Etch Process

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dc.contributor.author Rao, V. Ramgopal
dc.date.accessioned 2023-10-27T08:52:15Z
dc.date.available 2023-10-27T08:52:15Z
dc.date.issued 2011-03
dc.identifier.uri https://ieeexplore.ieee.org/document/5706349/keywords#keywords
dc.identifier.uri http://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12669
dc.description.abstract We report La 0.7 Sr 0.3 MnO 3 (LSMO)-Si heterojunctions fabricated using a new etch process that is compatible with standard CMOS technology. For a p-n-junction device fabrication, complete etch of a masked LSMO film was done using citric acid and was confirmed using superconducting quantum interferometry device magnetometry and energy-dispersive X-ray analysis. The etch conditions were found to have a negligible effect on the step height and electrical properties of other key silicon-technology materials such as photoresists, polysilicon, and silicon dioxide. This has been confirmed using profilometer measurements and C-V characteristics. en_US
dc.language.iso en en_US
dc.publisher IEEE en_US
dc.subject EEE en_US
dc.subject Citric acid etch en_US
dc.subject Magnetoelectronic devices en_US
dc.subject Manganite heterojunctions en_US
dc.subject Silicon technology en_US
dc.title Fabrication of La0.7Sr0.3MnO3–Si Heterojunctions Using a CMOS-Compatible Citric Acid Etch Process en_US
dc.type Article en_US


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