dc.contributor.author |
Rao, V. Ramgopal |
|
dc.date.accessioned |
2023-10-27T10:03:49Z |
|
dc.date.available |
2023-10-27T10:03:49Z |
|
dc.date.issued |
2010-09 |
|
dc.identifier.uri |
https://ieeexplore.ieee.org/document/5518393 |
|
dc.identifier.uri |
http://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12680 |
|
dc.description.abstract |
We present experimental and simulation studies of shallow trench isolation (STI)-type drain-extended n-channel metal-oxide-semiconductor devices under human body model (HBM)-like electrostatic discharge (ESD) conditions. Physical insight toward pulse-to-pulse instability is given. Both the current ( I TLP ) and time evolution of various events such as junction breakdown, parasitic bipolar triggering, and the base push-out effect are discussed in detail. Differences between the 2-D and 3-D simulation (modeling) approaches are presented, and the importance of 3-D technology-computer-aided-design-based modeling is discussed. Furthermore, a deeper physical insight toward the base push-out is given, which shows significant power dissipation due of space charge build-up, which is found at the onset of self-heating in the 2-D plane. |
en_US |
dc.language.iso |
en |
en_US |
dc.publisher |
IEEE |
en_US |
dc.subject |
EEE |
en_US |
dc.subject |
Base push-out |
en_US |
dc.subject |
Charge device model (CDM) |
en_US |
dc.subject |
Charge modulation |
en_US |
dc.subject |
Current filamentation |
en_US |
dc.subject |
Transient interferometric mapping (TIM) |
en_US |
dc.title |
On the Behavior of STI-Type DeNMOS Device Under ESD Conditions |
en_US |
dc.type |
Article |
en_US |