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On the Behavior of STI-Type DeNMOS Device Under ESD Conditions

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dc.contributor.author Rao, V. Ramgopal
dc.date.accessioned 2023-10-27T10:03:49Z
dc.date.available 2023-10-27T10:03:49Z
dc.date.issued 2010-09
dc.identifier.uri https://ieeexplore.ieee.org/document/5518393
dc.identifier.uri http://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12680
dc.description.abstract We present experimental and simulation studies of shallow trench isolation (STI)-type drain-extended n-channel metal-oxide-semiconductor devices under human body model (HBM)-like electrostatic discharge (ESD) conditions. Physical insight toward pulse-to-pulse instability is given. Both the current ( I TLP ) and time evolution of various events such as junction breakdown, parasitic bipolar triggering, and the base push-out effect are discussed in detail. Differences between the 2-D and 3-D simulation (modeling) approaches are presented, and the importance of 3-D technology-computer-aided-design-based modeling is discussed. Furthermore, a deeper physical insight toward the base push-out is given, which shows significant power dissipation due of space charge build-up, which is found at the onset of self-heating in the 2-D plane. en_US
dc.language.iso en en_US
dc.publisher IEEE en_US
dc.subject EEE en_US
dc.subject Base push-out en_US
dc.subject Charge device model (CDM) en_US
dc.subject Charge modulation en_US
dc.subject Current filamentation en_US
dc.subject Transient interferometric mapping (TIM) en_US
dc.title On the Behavior of STI-Type DeNMOS Device Under ESD Conditions en_US
dc.type Article en_US


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