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Device Design and Optimization Considerations for Bulk FinFETs

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dc.contributor.author Rao, V. Ramgopal
dc.date.accessioned 2023-10-30T06:16:53Z
dc.date.available 2023-10-30T06:16:53Z
dc.date.issued 2008-02
dc.identifier.uri https://ieeexplore.ieee.org/document/4436001
dc.identifier.uri http://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12711
dc.description.abstract Fabrication of FinFETs using bulk CMOS instead of silicon on insulator (SOI) technology is of utmost interest as it reduces the process costs. Using well-calibrated device models and 3-D mixed mode simulations, we show that bulk FinFETs can be optimized with identical performances as that of SOI FinFETs. Optimized bulk FinFETs are compared with the corresponding SOI FinFETs for a range of technology nodes using an extensive simulation and design methodology. Further, we extend the concept of body doping in bulk FinFETs to the case of lightly doped fins unlike the heavily doped fin cases reported earlier. The optimum body doping required for bulk FinFETs, and its multiple advantages are also systematically evaluated. We also show that device parasitics play a crucial role in the optimization of nanoscale bulk FinFETs. en_US
dc.language.iso en en_US
dc.publisher IEEE en_US
dc.subject EEE en_US
dc.subject Bulk fin-shaped field-effect transistor (FinFET) en_US
dc.subject Device parasitics en_US
dc.subject Fringe capacitance en_US
dc.subject SOI FinFET en_US
dc.subject Inverter delay en_US
dc.title Device Design and Optimization Considerations for Bulk FinFETs en_US
dc.type Article en_US


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