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Border-Trap Characterization in High-κ Strained-Si MOSFETs

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dc.contributor.author Rao, V. Ramgopal
dc.date.accessioned 2023-10-30T06:43:01Z
dc.date.available 2023-10-30T06:43:01Z
dc.date.issued 2007-08
dc.identifier.uri https://ieeexplore.ieee.org/document/4278369
dc.identifier.uri http://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12716
dc.description.abstract In this letter, we focus on the border-trap characterization of TaN/HfO 2 /Si and TaN/HfO 2 /strained-Si/Si 0.8 Ge 0.2 n-channel MOSFET devices. The equivalent oxide thickness for the gate dielectrics is 2 nm. Drain-current hysteresis method is used to characterize the border traps, and it is found that border traps are higher in the case of high-kappa films on strained- Si/Si 0.8 Ge 0.2 .These results are also verified by the 1/f-noise measurements. Possible reasons for the degraded interface quality of high-kappa films on strained-Si are also proposed. en_US
dc.language.iso en en_US
dc.publisher IEEE en_US
dc.subject EEE en_US
dc.subject Border traps en_US
dc.subject Charge pumping en_US
dc.subject Hysteresis en_US
dc.subject Interface trapping en_US
dc.subject Strained-Si en_US
dc.subject 1/f noise en_US
dc.title Border-Trap Characterization in High-κ Strained-Si MOSFETs en_US
dc.type Article en_US


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