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Reliability of ultrathin JVD silicon nitride MNSFETs under high field stressing

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dc.contributor.author Rao, V. Ramgopal
dc.date.accessioned 2023-10-30T10:48:43Z
dc.date.available 2023-10-30T10:48:43Z
dc.date.issued 2003-08
dc.identifier.uri https://ieeexplore.ieee.org/document/1222759
dc.identifier.uri http://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12737
dc.description.abstract In this paper, we study the reliability of n-channel Metal-Nitride-Silicon FETs fabricated using ultrathin Jet Vapor Deposited (JVD) Silicon Nitride gate dielectric under constant voltage stressing. Due to the stress, shifts in threshold voltage and transconductance as well as interface state generation are observed. Our study shows that degradation is polarity dependent. MNSFETs show lower degradation when the applied stress voltage is positive. We have also compared the performance of MNSFETs with conventional MOSFETs under identical stress conditions. Under positive stressing, MNSFETs clearly outperform the MOSFETs but under negative stressing MNSFETs show more degradation. en_US
dc.language.iso en en_US
dc.publisher IEEE en_US
dc.subject EEE en_US
dc.subject Silicon en_US
dc.subject MOSFETs en_US
dc.subject Stress en_US
dc.subject Voltage en_US
dc.subject Degradation en_US
dc.subject Dielectrics en_US
dc.subject Charge pumps en_US
dc.subject Interface states en_US
dc.title Reliability of ultrathin JVD silicon nitride MNSFETs under high field stressing en_US
dc.type Article en_US


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