| dc.description.abstract |
Conventional CMOS and MEMS technologies usually employ top-down fabrication methodologies for high volume manufacturing. However, as the CMOS technologies are scaled down, there are many challenges owing to its variability, reliability and power issues. Some of these issues in CMOS and MEMS technologies can be better addressed by employing a host of bottom-up nanotechnology approaches through innovative process integration strategies. This calls for an intelligent integration of diverse technologies, materials and processes on the same die or in a package for realization of future smart systems. Here we present some of these integration methodologies where completely diverse platforms, materials and approaches are brought together in order to realize a targeted system functionality. |
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