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On the Transient behavior of various drain extended MOS devices under the ESD stress condition

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dc.contributor.author Rao, V. Ramgopal
dc.date.accessioned 2023-11-02T10:56:54Z
dc.date.available 2023-11-02T10:56:54Z
dc.date.issued 2010
dc.identifier.uri https://ieeexplore.ieee.org/document/5682922
dc.identifier.uri http://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12824
dc.description.abstract This paper presents ESD evaluation of various nanoscale drain extended MOS devices. Current and time evolution of current filaments formed under the ESD stress conditions are investigated. A complete picture of device's behavior at the onset of space charge modulation and the evolution of current filamentation is discussed based on Transient Interferometric mapping studies. en_US
dc.language.iso en en_US
dc.publisher IEEE en_US
dc.subject EEE en_US
dc.subject Drain Extended MOS en_US
dc.subject Electrostatic discharge (ESD) en_US
dc.subject TIM en_US
dc.subject Base push-out en_US
dc.subject Current filamentation en_US
dc.title On the Transient behavior of various drain extended MOS devices under the ESD stress condition en_US
dc.type Article en_US


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