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On the failure mechanism and current instabilities in RESURF type DeNMOS device under ESD conditions

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dc.contributor.author Rao, V. Ramgopal
dc.date.accessioned 2023-11-02T11:19:51Z
dc.date.available 2023-11-02T11:19:51Z
dc.date.issued 2010-05
dc.identifier.uri https://ieeexplore.ieee.org/document/5488723
dc.identifier.uri http://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12829
dc.description.abstract We present 3D device modeling of RESURF or non-STI type DeNMOS device under ESD conditions. The impact of base push-out, pulse-to-pulse instability and electrical imbalance on the various phases of filamentation is discussed. A new phenomenon called “week NPN action” and the cause of early and fast failure is identified. A modification of the device is proposed which achieved an improvement of ~5X in failure threshold (I T2 ) and ~2X in ESD window without degrading its I/O performance. en_US
dc.language.iso en en_US
dc.publisher IEEE en_US
dc.subject EEE en_US
dc.subject Drain-extended MOSFET (DeMOS) en_US
dc.subject ESD Failure en_US
dc.subject Space charge buildup en_US
dc.subject Pulse-to-pulse instability en_US
dc.title On the failure mechanism and current instabilities in RESURF type DeNMOS device under ESD conditions en_US
dc.type Article en_US


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