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Benchmarking the device performance at sub 22 nm node technologies using an SoC framework

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dc.contributor.author Rao, V. Ramgopal
dc.date.accessioned 2023-11-03T04:04:01Z
dc.date.available 2023-11-03T04:04:01Z
dc.date.issued 2009
dc.identifier.uri https://ieeexplore.ieee.org/document/5424311
dc.identifier.uri http://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12832
dc.description.abstract For the first time this paper makes an attempt at predicting the System-on-Chip (SoC) performance (i.e. logic, SRAM, ESD and I/O) of various sub 20 nm channel length planar and non-planar SOI devices using extensive & well calibrated 3D device and mixed-mode TCAD simulations. It has been shown that the non-planar devices such as FinFETs are not the ideal choice for SoC applications and perform poorly in comparison to the Ultra thin body (UTB) planar SOI MOSFETs. We further show different strategies to optimize the planar UTB MOSFETs for improved ESD robustness and I/O performance. en_US
dc.language.iso en en_US
dc.publisher IEEE en_US
dc.subject EEE en_US
dc.subject Electrostatic discharges en_US
dc.subject FinFETs en_US
dc.subject Random access memory en_US
dc.subject Inverters en_US
dc.subject Nanoscale devices en_US
dc.subject MOSFETs en_US
dc.subject Integrated circuit interconnections en_US
dc.title Benchmarking the device performance at sub 22 nm node technologies using an SoC framework en_US
dc.type Article en_US


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