| dc.contributor.author |
Rao, V. Ramgopal |
|
| dc.date.accessioned |
2023-11-03T09:36:02Z |
|
| dc.date.available |
2023-11-03T09:36:02Z |
|
| dc.date.issued |
2008 |
|
| dc.identifier.uri |
https://ieeexplore.ieee.org/document/4617122 |
|
| dc.identifier.uri |
http://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12848 |
|
| dc.description.abstract |
We demonstrate a photoplastic NEMS device that has an encapsulated polysilicon piezoresistor. The crucial temperature limitation of depositing a polysilicon film on a polymer was overcome by employing a novel Hotwire CVD process. In this paper, we report the fabrication and characterization of a novel polymeric cantilever with an embedded piezoresistor, which exploits the low Youngs modulus of a polymer and high gauge factor of polysilicon. Such devices are widely used for sensing biochemicals. |
en_US |
| dc.language.iso |
en |
en_US |
| dc.publisher |
IEEE |
en_US |
| dc.subject |
EEE |
en_US |
| dc.subject |
Electrical resistance measurement |
en_US |
| dc.subject |
Substrates |
en_US |
| dc.subject |
Polymers |
en_US |
| dc.subject |
Voltage measurement |
en_US |
| dc.subject |
Distance measurement |
en_US |
| dc.title |
Photoplastic NEMS with an Encapsulated Polysilicon Piezoresistor |
en_US |
| dc.type |
Article |
en_US |