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Understanding the NBTI Degradation in Halo- Doped Channel p-MOSFETs

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dc.contributor.author Rao, V. Ramgopal
dc.date.accessioned 2023-11-06T06:52:40Z
dc.date.available 2023-11-06T06:52:40Z
dc.date.issued 2004-07
dc.identifier.uri https://ieeexplore.ieee.org/document/1345639
dc.identifier.uri http://dspace.bits-pilani.ac.in:8080/xmlui/handle/123456789/12868
dc.description.abstract The role of initial interface damage for negative bias temperature instability (NBTI) degradation has been examined for short channel MOSFET devices. In this paper we present a detailed study of the role of initial silicon-oxide interface quality on the NBTI degradation. Hole density and oxide fields are important parameters responsible for NBTI degradation. Our results show that NBTI degradation is independent of initial interface quality. en_US
dc.language.iso en en_US
dc.publisher IEEE en_US
dc.subject EEE en_US
dc.subject Niobium compounds en_US
dc.subject Titanium compounds en_US
dc.subject Degradation en_US
dc.subject MOSFET circuits en_US
dc.subject Interface states en_US
dc.subject Stress en_US
dc.title Understanding the NBTI Degradation in Halo- Doped Channel p-MOSFETs en_US
dc.type Article en_US


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